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International Symposium on Advanced Packaging Materials

Processes, Properties and Interfaces: Proceedings: Chateau Elan, Braselton, Georgia, March 11-14, 2001

International Symposium on Advanced Packaging Materials( )
Author: Morris, James E.
Contribution by: International Microelectronics and Packaging Society Staff,
ISBN:978-0-930815-64-6
Publication Date:Jan 2000
Publisher:IEEE
Book Format:Paperback
List Price:USD $162.00
Book Details
Pages:426
Detailed Subjects: Technology & Engineering / Industrial Design / Packaging
Physical Dimensions (W X L X H):7.8 x 10.53 Inches
Book Weight:2.246 Pounds



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