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6th International Symposium on Advanced Packaging Materials, 2000

6th International Symposium on Advanced Packaging Materials, 2000( )
Author: IEEE, Press Staff,
ISBN:978-0-930815-59-2
Publication Date:Jan 2000
Publisher:International Society for Hybrid Microelectronics
Book Format:Paperback
List Price:USD $140.00
Book Details
Pages:362
Detailed Subjects: Technology & Engineering / Industrial Design / Packaging
Physical Dimensions (W X L X H):8.58 x 10.92 Inches
Book Weight:2.145 Pounds



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